We appreciate your interest in Fujitsu Microelectronics Ltd part number MB81257-12, which is currently ready for procurement here on Prompt Aerospace. For your reference, part number MB81257-12 is listed with the NSN 5962-01-266-1459 and description “Microcircuit Memory.” If this is the item you are seeking and you would like to request a quote for your comparisons, simply complete the form below with information like your desired quantity, budget, and anticipated fulfillment timeframe. We regularly respond to requests within 15 minutes of receiving them, using the details we are offered to curate the most ideal purchasing options.
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If you want to explore other items produced by Fujitsu Microelectronics Ltd under the CAGE Code 61271 or that similarly fall under the FSC 5962 Microcircuits Electronic, keep in mind that since we list everything with relevant information, you can easily locate related part numbers using our search engine or catalogs. We also excel at tracking down parts with long lead times or that are generally hard to find, meaning that we can serve you even if you do not see exactly what you need on our website. With all of this being said, we are ready to help you source any of the NSN 5962-01-266-1459 parts and Microcircuit Memory items your operations require, so request a quote today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-266-1459 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012661459 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 8515203XX | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.505 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.305 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND DYNAMIC AND W/ENABLE AND W/STROBE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM TOTAL SUPPLY |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 LEADLESS |
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